FABRICATION OF CAPACITIVE ABSOLUTE PRESSURE SENSORS BY THIN FILM VACUUM ENCAPSULATION ON SOI SUBSTRATES
Manufacturing of absolute capacitive pressure sensors fabricated by polysilicon low-pressure chemical vapour deposition vacuum packaging on silicon-on-insulator substrates. The fabrication process proposed is carried out at wafer level and allows obtaining a large number of miniaturized sensors per substrate on 1x2 mm2 chips with high yield. The sensors present average pressure sensitivity of 8.3 pF/bar and average pressure resolution limit of 0.24 mbar within the measurement range 200-1200 mbar. |
SIMPLIFIED PROCESS FLOW
SEM IMAGES | |
Details of micro holes before (rigth) and after (center and left) the vacuum sealing by LPCVD thick film policristalline silicon |
OPTICAL IMAGES | ||
MICROSYSTEM PROCESSES HOME PAGE |