SEMI-AUTOMATIC PROBE STATIONS (PROBER MICROMANIPULATOR MM 6620 AND P200AI)

• I/V measurements in the range 0-1000 V with min 10 pA/1 mV  resolution (MM 6620) or 0-200 V with min 10 aA /0.5 mV  resolution (P200AI)
• High-Frequency (HF) at 100 kHz and Quasi-Static (QS) C–V characteristics
• Multi-Frequency AC impedance measurements (C-V, C-f, C-t)  in the range 1 kHz-5MHz, with 100 V DC bias

HALL EFFECT SYSTEM

This system allows measurements of resistivity, mobility and carrier concentration with a magnetic field source of 1 T and the possibility to heat the sample up to 400° C

FPP 5000 Veeco Instrument      

Automated 4-point probe for the measurement of resistive properties of semiconductor wafers and resistive films . The microprocessor based electronics on this tool permits direct computation of V/I, sheet or slice resistivity, and metallization thickness and P-N type testing.

OPTICAL PROFILOMETER

Non-contact system for surface topography analyses using white light interferometry

• Maximum height resolution 1nm, maximum lateral resolution 0.66 µm. 
• Magnification 10X, 50X and 100X with vacuum chuck and motorized XY-Stage.
• Z-Positioning system piezo-based with a height measuring range Up to 400 µm

The smartWLI product family uses white light interferometry to record 3D surface topography with depth resolution in the lower nanometer range. Because the measurement points are acquired and processed in parallel, height information can be gathered over a large area in a very short time. Typical applications in research and quality management include the characterization of surfaces with different roughness values (wafer structures, mirrors, glass, metals), the determination of step heights, and the precise measurement of curved surfaces

OCEAN USB4000-UV-VIS  - SPECTROMETER

The USB4000-VIS-NIR is a miniature spectrometer pre-configured for general visible and near-IR measurements

The light source is a combination of deuterium and  halogen lamp in the range 250-1000 nm (Avantes, model DH-2000). The incident light and Reflectance spectra are collected by fiber optics. Top-down and bottom-up measurement configurations are possible.

• Thin film thickness measurement by fitting of reflectance spectra. Examples of routine application are the measurement of SiO₂ thickness on Silicon and polysilicon thickness on SiO₂.
• Acquisition of transmittance spectra is possible if the thin film is deposited on a transparent substrate. Fitting of reflectance and transmittance spectra allows extracting the refractive index and extinction coefficient of unknown layers
• The fitting procedure allows to determine the volume fractions occupied by different materials in a thin layer
• The technique can be applied also to stacks of different materials (multilayers).

VEECO DEKTAK 150 MECHANICAL PROFILOMETER

• Performs contact-based 2D topography measurement to characterize film thickness, roughness, stress and defects on samples up to 100mm
• Delivers 1mm vertical range with 10 Å vertical resolution at 6.55 um range
• Has Step Height Repeatability of 7.5 Å step, 1 sigma
• Allows Maximum sample thickness of 25.4mm