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Normally off 4H-SiC MOSFET devices have been fabricated on a p-type semiconductor and electrically characterized at different temperatures. A gate oxide obtained by nitrogen ion implantation performed before the thermal oxidation of SiC has been implemented in n-channel MOSFET technology. Two samples with a nitrogen concentration at the SiO2/SiC interface of 5 X 1018 and 1.5 X 1019 cm-3 and one unimplanted sample have been manufactured. The sample with the highest N concentration at the interface presents the highest channel mobility and the lowest threshold voltage. For increasing temperature, in all the samples, the threshold voltage decreases, and the electron channel mobility increases. The latter case attains a maximum value of about 40 cm2/V ldr s at 200degC for the sample with the highest N concentration. These trends are explained by the reduction of interface electron traps in the upper …
Publication date: 
21 Mar 2008

Francesco Moscatelli, Antonella Poggi, Sandro Solmi, Roberta Nipoti

Biblio References: 
Volume: 55 Issue: 4 Pages: 961-967
IEEE Transactions on Electron Devices