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The paper presents a technology for strain sensing on steel using resonant MEMS packaged in vacuum. For this purpose, a custom sensor fabrication technology and a novel vacuum packaging technique have been developed. The MEMS sensors have been fabricated by surface micromachining of thick (15 μm) Silicon On Insulator substrates with heavily doped handle layers (ρ= 0.005 Ω cm). Using this process, Double-Ended Tuning Fork (DETF) parallel-plate resonators with reduced coupling gaps (less than 1 μm) have been fabricated, using a high-performance Deep Reactive Ion Etching performed on submicrometer features realized by near-UV lithography combined with a maskless line narrowing technique. The devices have been bonded to a thin steel bar by epoxy glue, packaged in vacuum and tested by applying strain to the bar, showing good tolerances to packaging parasitics, measurement …
Publication date: 
1 Jan 2010

Matteo Ferri, F Mancarell, Luca Belsito, Alberto Roncaglia, Jize Yan, Ashwin A Seshia, Kenichi Soga, J Zalesky

Biblio References: 
Volume: 5 Pages: 1426-1429
Procedia Engineering