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The reverse and forward currents of Al+ ion implanted 4H-SiC p+-in diodes have been compared for identically processed devices except for the implanted Al concentration in the emitter, 6× 10 19 cm-3 against 2× 10 20 cm-3, and the post implantation annealing treatment, 1600 C/30 min and 1650 C/25 min against 1950 C/5min. The diodes’ ambipolar carrier lifetime, as obtained by open circuit voltage decay measurements, has been compared too. The devices with lower annealing temperature show lower leakage currents and higher ambipolar carrier lifetime; they also show lower current in ohmic conduction.
Trans Tech Publications Ltd
Publication date: 
1 Jan 2017

Roberta Nipoti, Maurizio Puzzanghera, Giovanna Sozzi

Biblio References: 
Volume: 897 Pages: 439-442
Materials Science Forum