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WAFER BONDING PROCESSES

PROCESS SUBSTRATE MATERIAL SUBSTRATE # DIMENSION
ANODIC Si, Pirex 2 - 3 4 INCH
FUSION Si Up to 3 4 INCH
GLASS FRIT Si, Pirex, other 2 4 INCH
EUTECTIC Si 2 4 INCH
SIO Si, SiO2 2 4 INCH

 

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CONTACT PERSON: FULVIO MANCARELLA