| TECHNOLOGICAL STEP |
EQUIPMENT |
| |
|
| Ion Implantation |
1.7MV HV-Tandetron 4117HC |
| |
Eaton NV4206 |
| Conventional Annealing (diffusion, oxidation, ...) |
6 Tubes ASM 185-4 |
| UHT annealing |
SiC furnace J.I.P.ELEC |
| Low Pressure CVD |
2 Horizontal LPCVD SEMCO MINILAB DF 500-6 |
| |
2 LPCVD reactors: Polysilicon, Silicon Nitride |
| Plasma Enhanced Chemical Vapor Deposition |
RF-VHF multi chamber system |
| Rapid Thermal Process |
LPT RTP twin system |
| Vapor Prime process |
Delta 150 VPO Hotplate-BLE |
| Spin coater |
Delta 20-BLE |
| Baking |
2 Delta 150TT-BLE |
| Optical Lithography |
Front-to-back side Mask Aligner MA4 Karl-Süss |
| |
Front-side Mask Aligner MA/BA6 Karl-Süss with DUV Tools and Nanoimprint UV-Assisted |
| Nanolithography |
CrossBeam 340 FIB/EBL ZEISS-RAITH |
| Dry Etching |
RIE PLASMALAB |
| |
RIE SI 591 - Sentech |
| |
Stripper PVA - Tepla 200 |
| Deep Reactive Ion Etching |
Alcatel A601E |
| Wafer Bonding |
Bond Aligner BA6 Karl-Süss |
| |
Substrate Bonder SB6 Karl-Süss |
| Wet Etching |
RCA Cleaning Bench |
| |
Wet Bench |
| |
Micromachining Bench KOH |
| |
Micromachining Bench TMAH |
| Rinse Drier |
Semitool ST 240 and 270S model |
| Sputter Deposition |
MRC 8603 |
| |
MRC 8622 |
| Metal Evaporation |
VARIAN 3119 |
| Chemical vapor deposition |
Elettrorava & IMM Cold walls reactor |
| |
Hot walls reactor |
| Dicing |
ADT 7100 Series – 2” VECTUS |
